Livingston-based Optoscribe, a world-leading supplier of 3D glass-based integrated photonics components has formed
Optoscribe’s 3D glass-based photonic integrated circuits combine embedded waveguides and high precision micromachining for applications ranging from data centre optical transceiver interconnects, to fibre connectivity and consumer electronics.
This strategic cooperation will seed the market for practical use cases of Sumitomo Electric’s MCF interconnects. This is especially true for four core (or greater) MCF with fan-in / fan-out components based on 3D glass-based photonic technology in datacom applications where ultra-high density optical interconnect is required.
Nick Psaila, CEO of Optoscribe, said: “We are delighted to embark on this strategic cooperation with Sumitomo Electric. We see this as a great opportunity to jointly address the performance challenges faced by datacom and telecom applications, while creating and fostering the supply chain for further deployment of multicore fiber and related technologies.”
Tatsuo Saitoh, Head of Optical Communication Laboratory of Sumitomo Electric, said: “We believe that both companies with cutting edge technologies can create a new market and ecosystem for multicore fiber-based interconnects. We are excited that our products will solve customers’ challenges for ultra-high density optical interconnects.”
